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  i ntegrated c ircuits d ivision www.ixysic.com ds-cpc1705-r02 1 CPC1705Y single-pole, normally closed 60v, 3.25a dc , 4-pin power sip relay part # description CPC1705Y 4-pin (8-pin body) power sip package (25 per tube) parameter rating units blocking voltage 60 v p load current 3.25 a dc on-resistance (max) 0.09 ? applications features description ordering information pin configuration ? transportation railroad controls ? security ? battery backup systems ? industrial controls ? robotics ? instrumentation ? 3.25a dc load current ? 60v blocking voltage ? 90m ? maximum on-resistance ? 5ma input control current to activate ? 2500v rms input/output isolation ? power sip package ? high reliability ? arc-free with no snubbing circuits ? no emi/rfi generation ? flammability rating ul 94 v-0 the CPC1705Y is a 60v, 3.25a dc , 0.09 ? dc-switching, normally closed (1-form-b) solid state relay. to minimize printed circuit board space, this device is provided in ixys ic division's power single in-line package (powersip). employing optically coupled mosfet technology, the CPC1705Y provides 2500v rms of input to output isolation. the relay output is constructed with an efficient mosfet switch that utilizes ixys integrated circuits division's patented optomos architecture. a highly efficient infrared led at the input controls the optically coupled output. the combination of low on-resistance and high load current capability makes this relay suitable for a variety of high performance switching applications. switching characteristics of normally closed devices approvals ? ul 508 certified component: file e69938 ? csa certified component: certificate 1172007 t on t off i load i f form-b 10% 90%
i ntegrated c ircuits d ivision www.ixysic.com 2 r02 CPC1705Y absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. typical values are characteristic of the device at +25c, and are the result of engineering evaluations. they are provided for information purposes only, and are not part of the manufacturing testing requirements. absolute maximum ratings @ t a =25oc (unless otherwise noted) parameter ratings units blocking voltage 60 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw total power dissipation 2 1175 mw isolation voltage, input to output 2500 v rms esd rating (human body model) 4 kv operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 3.33 mw / oc 2 derate output power linearly 11.8 mw / oc parameter conditions symbol min typ max units output characteristics load current, continuous 1 free air i l - - 3.25 a dc peak load current t=10ms i lpk - - 3.25 a on-resistance 2 i l =1a r on - 0.059 0.09 ? off-state leakage current i f =5ma, v l =60v dc i leak --1a switching speeds turn-on output switch i f =10ma, v l =10v (see switching waveform) t on - 0.6 2 ms turn-off output switch t off - 2.84 12 output capacitance i f =10ma, v l =20v dc , f=1mhz c out -1 -nf input characteristics input control current to activate 3 i l =0a i f - 0.8 5 ma input control current to deactivate i l =1a i f 0.1 0.8 - ma input voltage drop i f =5ma v f 0.9 1.2 1.5 v reverse input current v r =5v i r - - 10 a input/output characteristics capacitance, input-to-output v io =0v, f=1mhz c io -2 -pf 1 derate linearly 20.5 ma/oc. 2 measurement taken within 1 second of on-time. 3 for high-temperature operation (t a > 60oc) a minimum led drive current of 10ma is recommended. electrical characteristics @ t a =25oc (unless otherwise noted) parameter symbol rating units thermal impedance (junction to ambient) ? ja 85 c/w thermal characteristics switching waveform form-b i f 10% 90% i load t off t on
i ntegrated c ircuits d ivision CPC1705Y www.ixysic.com 3 r02 *the performance data shown in the graphs above is typical of device operation. unless otherwise noted, data is presented at 25 oc. for guaranteed parameters not indicated in the written speci? cations, please contact our application department. performance data* led forward voltage (v) 1.218 1.220 1.222 1.224 1.226 1.228 1.230 device count (n) 0 5 10 15 20 25 typical led forward voltage drop (n=50, i f =5ma) led forward current (ma) 0.26 0.30 0.34 0.38 0.42 0.46 0.50 0.54 device count (n) 0 5 10 15 typical i f for switch operation (n=50) led forward current (ma) 0.27 0.31 0.35 0.39 0.43 0.47 0.51 device count (n) 0 5 10 15 20 25 typical i f for switch dropout (n=50) on-resistance ( : ) 0.048 0.050 0.052 0.054 0.056 0.058 0.060 0.062 device count (n) 0 5 10 15 20 25 30 typical on-resistance distribution (n=50, i l =1a) turn-off time (ms) 2.2 2.6 3.0 3.4 3.8 device count (n) 0 5 10 15 20 25 30 35 typical turn-off time (n=50, i f =10ma) turn-on time (ms) 0.60 0.62 0.64 0.66 0.68 0.70 0.72 device count (n) 0 5 10 15 20 25 30 typical turn-on time (n=50,i f =10ma) blocking voltage (v p ) 76 77 78 79 80 81 device count (n) 0 5 10 15 20 25 typical blocking voltage distribution (n=50, i f =10ma) temperature (oc) -40 -20 0 20 40 60 80 100 led current (ma) 0.25 0.30 0.35 0.40 0.45 0.50 0.55 typical i f for switch dropout vs. temperature temperature (oc) -40 -20 0 20 40 60 80 100 forward voltage (v) 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 typical led forward voltage drop vs. temperature i f =15ma i f =10ma i f =5ma temperature (oc) -40 -20 0 20 40 60 80 100 led current (ma) 0.25 0.30 0.35 0.40 0.45 0.50 0.55 typical i f for switch operation vs. temperature
i ntegrated c ircuits d ivision www.ixysic.com 4 r02 CPC1705Y *the performance data shown in the graphs above is typical of device operation. unless otherwise noted, data is presented at 25 oc. for guaranteed parameters not indicated in the written speci? cations, please contact our application department. performance data* load voltage (v) 0.00 0.05 0.10 0.15 0.20 load current (a) 0 0.5 1 1.5 2 2.5 3 3.5 typical load current vs. load voltage (i f =5ma) forward current (ma) 0 1020304050 turn-on time ( p s) 0 100 200 300 400 500 600 700 800 typical turn-on time vs. led forward current forward current (ma) 0 1020304050 turn-off time (ms) 0 2 4 6 8 10 12 typical turn-off time vs. led forward current (i f =5ma) load current (ma) 0 200 400 600 800 1000 on-resistance ( : ) 0.00 0.02 0.04 0.06 0.08 0.10 typical on-resistance vs. load current temperature (oc) -40 -20 0 20 40 60 80 100 turn-on time (ms) 0.0 0.2 0.4 0.6 0.8 1.0 typical turn-on time vs. temperature (i l =100ma) temperature (oc) -40 -20 0 20 40 60 80 100 turn-off time (ms) 0 1 2 3 4 5 6 7 8 9 10 typical turn-off time vs. temperature (i l =100ma) i f =5ma i f =10ma i f =15ma temperature (oc) -40 -20 0 20 40 60 80 100 on-resistance (m : ) 0 10 20 30 40 50 60 70 typical on-resistance vs. temperature (i f =5ma) temperature (oc) -40 -20 0 20 40 60 80 100 load current (a) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 maximum load current vs. temperature (i f =5ma) temperature (oc) -40 -20 0 20 40 60 80 100 blocking voltage (v p ) 50 60 70 80 90 100 typical blocking voltage vs. temperature (i f =10ma) temperature (oc) temperature (oc) -40 -20 0 20 40 60 80 100 leakage current leakage current vs. temperature (i f =10ma, v l =60v) 1pa 10pa 100pa 1na 10na 100na 1 p a 10 p a load voltage (v) 0 5 10 15 20 capacitance (nf) 0 1 2 3 4 5 6 output capacitance vs. load voltage (i f =10ma)
i ntegrated c ircuits d ivision CPC1705Y www.ixysic.com 5 r02 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) classi cation CPC1705Y msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . soldering profile provided in the table below is the classification temperature (t c ) of this product and the maximum dwell time the body temperature of this device may be (t c - 5)oc or greater. the classification temperature sets the maximum body temperature allowed for this device during lead-free reflow processes. for through-hole devices, and any other processes, the guidelines of j-std-020 must be observed. device classi cation temperature (t c ) dwell time (t p ) max re ow cycles CPC1705Y 245oc 30 seconds 1 board wash ixys integrated circuits division recommends the use of no-clean flux formulations. board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. these precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. additionally, the device must not be exposed to flux or solvents that are chlorine- or fluorine-based.
i ntegrated c ircuits d ivision ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-cpc1705-r02 ?copyright 2017, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 10/10/2017 for additional information please visit our website at: www.ixysic.com 6 CPC1705Y mechanical dimensions dimensions mm (inches) 1.150 dia. x4 (0.045 dia. x4) 2.540 (0.100) pin 1 10.160 (0.400) 5.080 (0.200) 1.75 (0.069) 10.1600.127 (0.4000.005) 21.0820.381 (0.8300.015) 4.5720.127 (0.1800.005) 1.0160.127 (0.0400.005) 10.1600.127 (0.4000.005) 1.778 (0.070) 5.0800.127 (0.2000.005) 2.5400.127 (0.1000.005) 0.7620.076 (0.0300.003) 1.6510.102 (0.0650.004) 7o typ 4 places 7o typ 4 places 3.3020.051 (0.1300.002) 0.3810.013 (0.0150.0005) 1.778 (0.070) pcb hole pattern pin 1 note: pin-to-pin tolerances are non-cumulative.


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